Editors: | F. Kongoli, M. Barinova, F. Ahmed, H. Ozgunay, K. Tang, N. Thanh, C. Gaidau, X. GUO. |
Publisher: | Flogen Star OUTREACH |
Publication Year: | 2022 |
Pages: | 156 pages |
ISBN: | 978-1-989820-42-1(CD) |
ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
This paper focused on the modeling of ecological treatment of printed circuit boards (PCB). Due to the high increase in the production of electronic waste, which contains a whole range of usable components, it is necessary to recycle it. We have proposed a solution for the separation of conductive paths from plastics, taking into account the legislative approaches,the existing methods of PCB separation, the composition, and the production of PCBs and also the binders used in PCBs. We used the knowledge of process engineering to design a mathematical description of temperature fields in PCBs and the stress. To a great extent, we have devoted ourselves to the simulation experiments of PCB heating and cooling and the determination of temperature fields and the corresponding temperature-dependent cyclic mechanical stresses. The simulation was performed in the Pro / ENGINEER and COMSOL Multiphysics® software environments, because of the possibility of solving multiphysical problems. The outputs from computer simulations are the initial stage for the design of an eco-friendly way of recycling PCBs. In the future, we will focus on the more complicated issue of recycling multilayer PCBs. The development of new criteria for PCB recycling has opened new possibilities for the treatment of the used materials.