2018 - Sustainable Industrial Processing Summit & Exhibition
4-7 November 2018, Rio Othon Palace, Rio De Janeiro, Brazil
Seven Nobel Laureates have already confirmed their attendance: Prof. Dan Shechtman, Prof. Sir Fraser Stoddart, Prof. Andre Geim, Prof. Thomas Steitz, Prof. Ada Yonath, Prof. Kurt Wüthrich and Prof. Ferid Murad. More than 400 Abstracts Submitted from about 60 Countries.
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    Electroless Metal Deposition Using Multivalent Metal Ions as Reducing Agents
    Eugenijus Norkus1;
    1CENTER OF PHYSICAL SCIENCES AND TECHNOLOGY, Vilnius, Lithuania;
    PAPER: 136/Electrochemistry/Invited (Oral)
    SCHEDULED: 15:55/Wed./Copacabana B (150/1st)



    ABSTRACT:
    The possibility and conditions of using lower oxidation state metal ions as reducing agents for autocatalytic electroless metal deposition are discussed. The theoretical background of these types of reactions is presented from a thermodynamics perspective. Kinetic data on electroless silver, copper, palladium, and platinum deposition, using Co (II)/Co (III) redox systems with different ligands are presented and discussed. Ti (III)/Ti (IV) redox systems with different ligands were also shown to be suitable reducing agents for reducing Pt (IV), Pd (II), Ni (II) and Co (II) to a metallic state and forming a continuous metal layer on the surface to be plated. The morphology of metal layers deposited using above-mentioned reducing agents was characterized by means of Field Emission Scanning Electron Microscopy (FESEM). Kinetics of the metal deposition rate was investigated by means of the gravimetry or Electrochemical Quartz Crystal Microgravimetry (EQCM).

    References:
    [1]. E. Norkus, I. Stankeviciene, A. Jagminiene, A. Joi, L. Tamašauskaite-Tamašiūnaite, Y. Dordi, Z. Sukackiene. "Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents". U.S. Pat. 9428836 B2 (2016).
    [2]. E. Norkus, A. Jagminiene, A. Žieliene, I. Stankeviciene, L. Tamašauskaite-Tamašiūnaite, A. Joi, Y. Dordi. "Electroless deposition of continuous platinum layer". U.S. Pat. 9469902 B2 (2016).
    [3]. E. Norkus, I. Stankeviciene, A. Jagminiene, L. Tamašauskaite-Tamašiūnaite, A. Joi, Y. Dordi. "Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent". U.S. Pat 9499913 B2 (2016).