2018-Sustainable Industrial Processing Summit
SIPS2018 Volume 2. Amatore Intl. Symp. / on Electrochemistry for Sustainable Development
| Editors: | F. Kongoli, H. Inufasa, M. G. Boutelle , R. Compton, J.-M. Dubois, F. Murad |
| Publisher: | Flogen Star OUTREACH |
| Publication Year: | 2018 |
| Pages: | 216 pages |
| ISBN: | 978-1-987820-84-3 |
| ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
CD shopping page
Density Functional Theory Studies of Cu and Sn Surfaces relevant for Electroplating
Shannon K. Stauffer1; Linas Vilčiauskas1; Arvydas Survila1;1CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY, Vilnius, Lithuania;
Type of Paper: Regular
Id Paper: 262
Topic: 47
Abstract:
Electrocodeposition of various Cu and Sn alloys to obtain metallic coatings is a process with a wide range of practical applications, from microelectronics to corrosion protection [1]. Such coatings show good solderability, malleability, and superior corrosion resistance. In order to control the co-deposition process and obtain the desired characteristics of final coatings, various surface active additives are traditionally employed [2-3]. Polyether (PE) compounds such as polyethylene glycol (PEG) is one of the well-known electroplating additives used to control Cu deposition rate. A number of studies have discussed the effects and underlying mechanisms of PEG for Cu deposition [4], however the effects of PEG in the case of Sn and Cu/Sn alloys are not well understood. In this work, we use periodic density functional theory calculations of various Cu and Sn surfaces and their interactions with various model adsorbates, such as ethylene glycol, oligoethylene glycols of various chain lengths, and PEG. In addition, to significantly differentiate electronic structure of Cu and Sn surfaces, the results also show different adsorption of hydroxyl, ether, and polyether species on these surfaces, which might explain the different behaviors of Cu/Sn electroplating.