2018-Sustainable Industrial Processing Summit
SIPS2018 Volume 2. Amatore Intl. Symp. / on Electrochemistry for Sustainable Development
| Editors: | F. Kongoli, H. Inufasa, M. G. Boutelle , R. Compton, J.-M. Dubois, F. Murad |
| Publisher: | Flogen Star OUTREACH |
| Publication Year: | 2018 |
| Pages: | 216 pages |
| ISBN: | 978-1-987820-84-3 |
| ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
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Electroless Metal Deposition Using Multivalent Metal Ions as Reducing Agents
Eugenijus Norkus1;1CENTER OF PHYSICAL SCIENCES AND TECHNOLOGY, Vilnius, Lithuania;
Type of Paper: Invited
Id Paper: 136
Topic: 47
Abstract:
The possibility and conditions of using lower oxidation state metal ions as reducing agents for autocatalytic electroless metal deposition are discussed. The theoretical background of these types of reactions is presented from a thermodynamics perspective. Kinetic data on electroless silver, copper, palladium, and platinum deposition, using Co (II)/Co (III) redox systems with different ligands are presented and discussed. Ti (III)/Ti (IV) redox systems with different ligands were also shown to be suitable reducing agents for reducing Pt (IV), Pd (II), Ni (II) and Co (II) to a metallic state and forming a continuous metal layer on the surface to be plated. The morphology of metal layers deposited using above-mentioned reducing agents was characterized by means of Field Emission Scanning Electron Microscopy (FESEM). Kinetics of the metal deposition rate was investigated by means of the gravimetry or Electrochemical Quartz Crystal Microgravimetry (EQCM).
Keywords:
Catalysis; Electrochemistry;References:
[1]. E. Norkus, I. Stankeviciene, A. Jagminiene, A. Joi, L. Tamašauskaite-Tamašiūnaite, Y. Dordi, Z. Sukackiene. "Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents". U.S. Pat. 9428836 B2 (2016).[2]. E. Norkus, A. Jagminiene, A. Žieliene, I. Stankeviciene, L. Tamašauskaite-Tamašiūnaite, A. Joi, Y. Dordi. "Electroless deposition of continuous platinum layer". U.S. Pat. 9469902 B2 (2016).
[3]. E. Norkus, I. Stankeviciene, A. Jagminiene, L. Tamašauskaite-Tamašiūnaite, A. Joi, Y. Dordi. "Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent". U.S. Pat 9499913 B2 (2016).