Editors: | Kongoli F, Bordas S, Estrin Y |
Publisher: | Flogen Star OUTREACH |
Publication Year: | 2015 |
Pages: | 300 pages |
ISBN: | 978-1-987820-24-9 |
ISSN: | 2291-1227 (Metals and Materials Processing in a Clean Environment Series) |
In this work, we employ the dual boundary element method to model crack propagation in plane micropolar elasticity. We use both - the singular and hyper-singular - boundary integral equations on the coincident parts of the boundary to model a crack. Next, we evaluate the J-integrals from the solution fields in the vicinity of a crack tip and use them to derive the stress and couple stress intensity factors and formulate the criteria of crack propagation.
The BEM-formulation allows to incorporate voids and inclusions of different micropolar materials with perfect and imperfect interfaces and analyze their effect on crack paths.
We study several benchmark problems and compare the results with classical elasticity.